20th ASME Annual Conference on Information Storage & Processing Systems 2010

Welcome to the homepage of the 20th ASME Annual Conference on Information Storage & Processing Systems (aka ISPS).  The ISPS-2010 is sponsored by the ISPS Division of the ASME and will be held on June 14 and 15, 2010 at Santa Clara University, Santa Clara, California, USA.

Contributions are solicited to present at the upcoming ASME ISPS division’s annual conference to be held at Santa Clara University, CA, USA for June 14 and 15, 2010.  The ISPS is the division of American Society of Mechanical Engineers focuses primary on Information Storage and Processing Systems.  Relevant technologies in this annual ISPS conference include (a) magnetic and optical storage systems such as rigid disk, flexible disk, tape media, and optical storage systems, (b) information processing systems such as copiers, printers, digital cameras, scanners, and data servers, (c) nano/micro-electrical-mechanical systems, materials, and wearable systems, and (d) mechatronic-systems including intelligent machines, biomedical equipment, robotics, and automation systems.   

The scope of the conference is comprised of the following interdisciplinary research and application topics involved in the information storage and processing systems:

• Tribology, Head/Media Interface: Contact mechanics, lubrication, friction, wear, contamination, corrosion, thin films, heat-assisted recording, magnetic recording.
• Actuator/Suspension and Sensor: Designs and analyses of actuators and novel sensor technologies.
• Servo Control Technology: System dynamics and designs of modern, high precision servo control systems.
• Shock and Flow Induced Vibrations: Air-flow system, flow-structure interaction, shock and vibrations.
• Spindle Motor and Acoustics: Tribology, vibrations, dynamics, and acoustics of disk/media-spindle systems.
• Micro/Nano Technology:  Novel design concept & applications, pattern media, and materials.
• Biomedical and Intelligent Machines: System designs for biomedical devices and intelligent machines.
• Robotics, Vision, and Automation: Novel information-mechatornics involving robots and automation.
• Consumer Electronics and Future Tech: Digital camera, camcorder, thermal/laser printing, energy harvesting, smart house, ecosystems and other novel technologies and applications.
• Opto-Mechatronics:  Design and analysis of integrated opto-mechatronics and storage systems and media.
• Flexible Media Mechanics and Tape Storage: Mechanics and system design of lateral motion, tension, wear, and dynamics of high speed flexible tape, web, sheet metal, paper systems.

The ASME ISPS-2010 Conference will host the following special features for conference attendees:

• Discount registration fees for ASME members and reduced registration fees for students.
• Each paid attendee with full or discount registration fees will receive
  • A hard copy proceeding of all conference papers
  • A CD proceeding containing conference program and papers
  • A hard copy of Special Edition of Springer Journal of Microsystem Technologies containing peer-reviewed full journal quality papers after the conference.
• Student Program:
  • Six Conference Scholarships to waive graduate students’ conference registration fees.
  • Two ISPS Division Graduate Student Fellowships each consists of a monetary award of $1500 and free registration for the conference.
• Best Paper Awards:
  • One Best Track Paper Award for each technical track.
  • One Best Student Conference Paper Award
  • One Best Conference Industry Paper Award
  • One Best Academic Conference Paper Award
  • One Best Industry-Academic Conference Paper Award

The best track paper awards will be judged by Track Organizers based on the 3-page short paper prior to the conference. The ASME ISPS Division Executive Committee will make final decision for the other awards based on recommendations from Track Organizers.  For each award, a certificate will be presented to individual in the conference banquet. 

On behalf of the Conference Executive and Steering Committees, We look forward to seeing you in the conference!